Process capability

Layers	Mass production: 1~20 layers
Max. Thickness	Mass production: 394mil (10mm)
Material	FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , PI, Aluminium etc.
Min. Width/Spacing	Inner layer: 3.5mil/3.5mil (HOZ), Outer layer: 4mil/4mil(1OZ)
Max. Copper Thickness	UL certificated: 6.0 OZ
Min. Hole Size	Mechanical drill: 8mil（0.2mm） Laser drill: 4mil（0.10mm）
Max. Panel Size	1400mm × 560mm
Aspect Ratio	12：1
Surface Finish	HASL、Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, Gold Finger
Special Process	Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density.